Also features superior anti-blooming performance inherent to all CIDs, and command stop motion to capture and read asynchronous high-speed events in center frame. A versatile camera head-mounting feature simplifies installation in small spaces, and the standard “C” mount lens adapter provides back-focus adjustments.
- Camera is tolerant to gamma, neutron, high energy electrons, and proton radiation
- Since pixel charge readout is within the CID pixel, there is limited potential of single event disruptions common with other imaging technologies
- CID structure is inherently radiation resistant, and with specific modifications to the CID process, has been radiation hardened
- CID cameras allow at least an order of magnitude improvement in operation in radiation environments compared to CCD and CMOS-based cameras
- Imager is also inherently anti-blooming and tolerant to highly specular lighting overloads
- Optical overloads are highly contained within each pixel or the immediately surrounding pixels so charge is not shared with adjacent rows or columns
- Spectral response is from 200nm to 1100nm and coatings are available for X-ray, deep UV and IR
- CID imagers have a contiguous uniform pixel structure where the total sensor is active with virtually no opaque areas which facilitate interpixel interpolation for subpixel edge definition
- Compact remote head is easily replaceable and connects to a Camera Control Unit via flexible cable supplied to length
- Charge Injection Device (CID) Rad Hard Technology
- 1 x 106 Rad Total Dose (gamma)
- Excellent Image at 7 x 105 rads/hr
- High-resolution / small size
- Replaceable remote head
- No geometric distortion
- 1:1 aspect pixels
- Precise edge detection
- Selectable 2x, and 0.5 video gain boost
Ordering Alerts: Cameras are available in RS-170 or Progressive Scan formats upon request. Options include Color and custom versions, with partnered programs for Air or Underwater operation.
Required Accessories: Requires an external power source supplying +11.5 to +17VDC.
Recommended for: - Inspection and measurement
- Process monitoring
- Robotic handling
- Hot cell monitoring
- Laser beam profiling
- Research
